Systems and methods for obtaining information about a plasma load

ABSTRACT

A power generation system and method for identifying characteristics of a plasma load are disclosed. The power generation system may include a power source configured to apply a primary power signal at a primary frequency to an output and one or more secondary power signals at one or more secondary frequencies to the output. A sensor is arranged to monitor a characteristic of the power delivered to the plasma load, and an identification module analyzes the monitored characteristic to extract characteristics of the plasma load.

CLAIM OF PRIORITY UNDER 35 U.S.C. §119

The present application for patent claims priority to ProvisionalApplication No. 62/064,833 entitled “NOISE BASED FREQUENCY TUNING ANDIDENTIFICATION OF PLASMA CHARACTERISTICS” filed Oct. 16, 2014 andassigned to the assignee hereof and hereby expressly incorporated byreference herein.

FIELD OF THE DISCLOSURE

The present disclosure relates generally to frequency tuning agenerator. In particular, but not by way of limitation, the presentdisclosure relates to systems, methods and apparatuses for frequencytuning a generator in a plasma processing system and the identificationof plasma characteristics or changes in plasma characteristics.

BACKGROUND

Automated frequency tuning often seeks to match a load impedancepresented to a generator to an impedance into which a generator isdesigned to deliver power. In some instances this can be accomplished byminimizing the magnitude of a load reflection coefficient, ρ, defined as

$\begin{matrix}{\rho = \frac{Z - Z_{0}}{Z + Z_{0}^{*}}} & {{Equation}\mspace{14mu} (1)}\end{matrix}$

where Z is the load impedance presented to the generator, Z₀ is thedesired load impedance and * indicates taking the complex conjugate. Inmany applications Z₀=Z₀*=50Ω.

Automated tuning algorithms sometimes gravitate to a local optimum andthereby miss a global optimum. FIG. 8 illustrates a plot of a measure ofperformance (e.g. reflected power or load reflection coefficientmagnitude) as a function of frequency showing a local minimum at f₁ anda global minimum at f₀. In this illustration finding the optimum isequivalent to finding the minimum of the measure of performance. One cansee that if the automated frequency tuning begins at a lower frequencythan f_(a), then the algorithm is likely to settle in the local minimumat f₁ and be unaware of the global minimum at f₀.

For simple loads it is possible to simply sweep the frequency over theentire frequency range to find the global optimum at f₀. In plasmaapplications such an approach to finding the global optimum frequency isoften not an option. One potential problem is that as the frequency isswept, frequencies such as f_(a) in FIG. 8, may be encountered where theload impedance is badly mismatched to the impedance into which thegenerator can deliver power. If the generator frequency dwells for anyamount of time at such a frequency where the generator cannot deliversufficient power into the load, the plasma may extinguish. If shortperiods of high reflected power are acceptable, then a technique ofprobing the entire frequency range by changing frequency for only ashort period of time in order to probe different frequencies may be anacceptable solution to finding the global optimum frequency. However, insome applications even these short duration plasma disturbances are notacceptable. A solution for finding the global optimum with minimaldisturbance of the plasma load is desired. In many applications findingthe optimum operating frequency is equivalent to minimizing the loadimpedance mismatch, but other factors such as stability of the plasmasystem and efficiency of the system may factor into the optimality of afrequency.

SUMMARY OF THE DISCLOSURE

Exemplary embodiments of the present invention that are shown in thedrawings are summarized below. These and other embodiments are morefully described in the Detailed Description section. It is to beunderstood, however, that there is no intention to limit the inventionto the forms described in this Summary of the Invention or in theDetailed Description. One skilled in the art can recognize that thereare numerous modifications, equivalents and alternative constructionsthat fall within the spirit and scope of the invention as expressed inthe claims.

An aspect may be characterized as a power generation system configuredfor identifying characteristics of a plasma load. The power generationsystem includes a power source configured to apply a primary powersignal at a primary frequency to an output and concurrently applying oneor more secondary power signals at one or more secondary frequencies tothe output. The power produced at the secondary frequencies is lowerthan power produced at the primary frequency. A sensor is arranged tomonitor a characteristic of the power delivered to the plasma load, andthe system includes an identification module that analyzes the monitoredcharacteristic to extract characteristics of the plasma load.

Another aspect may be characterized as a power generation systemconfigured for identifying characteristics of a plasma load. The powergeneration system includes a power source to apply a primary powersignal and one or more secondary power signals at one or more secondaryfrequencies to the plasma load, wherein power produced at the secondaryfrequencies is lower than power produced at the primary frequency. Asensor is arranged to sense power delivered to the plasma load, and anidentification module is configured to provide information about theplasma load. The identification module includes a non-transitory,tangible machine readable storage medium, encoded with instructions toperform a method for providing the information about the plasma load.The method includes applying the primary power signal at a primaryfrequency to the plasma load and concurrently applying the one or moresecondary power signals at one or secondary frequencies to the plasmaload. The monitored characteristic is then analyzed to extractcharacteristics of the plasma load.

BRIEF DESCRIPTION OF THE DRAWINGS

Various objects and advantages and a more complete understanding of thepresent invention are apparent and more readily appreciated by referringto the following detailed description and to the appended claims whentaken in conjunction with the accompanying drawings:

FIG. 1 illustrates a power generation system configured for automatedfrequency tuning of power delivered to a plasma load.

FIG. 2 illustrates one embodiment of a power generation system where thesensor resides within a power generation system along with a powersource and one or more circuits.

FIG. 3 illustrates one embodiment of a power generation system where asensor resides outside the power generation system.

FIG. 4 illustrates a further embodiment of a power generation system.

FIG. 5 illustrates an embodiment of a power generation system where theprimary power signal and the secondary power signal are combined beforeamplification by a power amplifier.

FIG. 6 illustrates an embodiment of a power generation system where thepower source generates the primary power signal and a noise sourcegenerates the secondary power signal in the form of noise.

FIG. 7 illustrates an embodiment of a power generation system where thesecondary signal is noise and the primary power signal and the secondarypower signal are combined before amplification by a power amplifier.

FIG. 8 shows a plot of a measure of performance as a function offrequency.

FIG. 9A is a graph depicting a measure of performance (e.g., reflectioncoefficient) as a function of frequency.

FIG. 9B is a graphical representation depicting how a primary powersignal frequency may be adjusted to minimize the measure of performancedepicted in FIG. 9A.

FIG. 9C depicts a spectrum (power per bandwidth, e.g., Watts per 3 kHzbandwidth) of the power generation system output at time t2 in FIG. 9B.

FIG. 10A is a graph depicting a measure of performance versus frequency.

FIG. 10B is a plot depicting how a global search using the primary powersignal can lead to an extinguished plasma.

FIG. 10C is a graph showing a spectrum of the power generation systemoutput at time t2 in FIG. 10B.

FIG. 11A is graph depicting an estimate of optimum frequency using asecondary power signal.

FIG. 11B is a graph depicting adjustment of a primary frequency after adetermination of the desired frequency using a secondary power signals.

FIG. 11C is a graph showing spectral components of the power at theprimary signal and the secondary signal of FIG. 11B.

FIG. 12A is a graph depicting an estimate of optimum frequency using asecondary power signal.

FIG. 12B is a graph depicting adjustment of a primary frequency after adetermination of the desired frequency using secondary power signals.

FIG. 12C is a graph depicting spectral components of the power at theprimary signal and the secondary signals of FIG. 12B.

FIG. 13A is a graph depicting an estimate of optimum frequency using asecondary power signal;

FIG. 13B is a graph depicting noise power as a function of time wherenoise is added to the power generation system output.

FIG. 13C is a graph depicting shows the spectrum of the power generationsystem output at time t2 in FIG. 13B.

FIG. 14A is a graph depicting aspects of a method for frequency tuning;

FIG. 14B is a graph depicting additional aspects of the method forfrequency tuning shown in FIG. 14A;

FIG. 14C is a graph depicting further aspects of the method forfrequency tuning depicted in FIGS. 14A and 14B;

FIG. 14D is a graph depicting yet additional aspects of the method forfrequency tuning depicted in FIGS. 14A, 14B, and 14C;

FIG. 15A is a graph depicting aspects of a method for frequency tuning;

FIG. 15B is a graph depicting additional aspects of the method forfrequency tuning depicted in FIG. 15A;

FIG. 15C is a graph depicting further aspects of the method forfrequency tuning depicted in FIGS. 15A and 15B;

FIG. 16 illustrates a method for frequency tuning a power generationsystem that may be traversed in connection with embodiments describedherein.

FIG. 17A is a diagram depicting an exemplary sensor.

FIG. 17B is a diagram depicting another embodiment of a sensor.

FIG. 17C is a diagram depicting yet another embodiment of a sensor.

FIG. 18 is a diagram depicting aspects of an exemplary identificationmodule.

FIG. 19 is a block diagram depicting components that may be utilized torealize embodiments disclosed herein.

DETAILED DESCRIPTION

The word “exemplary” is used herein to mean “serving as an example,instance, or illustration.” Any embodiment described herein as“exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments.

For the purposes of this disclosure, a “low level signal” is one that issubstantially lower than a primary signal being delivered to a plasmachamber, for instance at least an order of magnitude smaller.

For the purposes of this disclosure, a “circuit” can include anycombination of electrical components that generate an output signalbased on an input signal. A circuit can be digital, analog, or part ofor comprising a processor or central processing unit (CPU). A circuitcan include, or can read from, a non-transitory, tangible computerreadable storage medium with processor readable instructions forperforming the methods described below.

For the purposes of this disclosure, components can be in communication,which in some cases includes electrical communication (e.g., able tosend signals therebetween) However, one of skill in the art willrecognize that communication can also include optical and wireless radiocommunications, to name two non-limiting examples.

For the purposes of this disclosure, a “global optimum” can include aminimum or maximum value for a characteristic as sampled across a rangeof frequencies. For instance, where reflected power is thecharacteristic, the global optimum can be a global minimum, while wheredelivered power is the characteristic, the global optimum can be aglobal maximum.

The present disclosure relates generally to a power generator systemconfigured to generate and apply (in addition to plasma-sustaining powerat a primary frequency) a secondary power signal (e.g., including one ormore frequencies) that is much lower in power than the plasma-sustainingpower. Beneficially, the application of the secondary power signalenables one or more aspects of the plasma load to be monitored withoutadversely affecting the plasma load itself. In addition, when theplasma-sustaining power is applied to a plasma load via a match network,the application of the low level signal may be applied with one or moreparticular frequencies that result in detectable frequencies (e.g.,mixing and intermodulation frequencies) that are passed by the narrowfiltering band of the match network. Moreover, information obtainedabout the plasma load may be used to control one or more aspects of thegenerator.

In terms of generator control for example, automated frequency tuningmay be performed using the information about the plasma load. Inparticular, a global optimum of some measure of performance may beobtained, and the generator may be adjusted towards this global optimumfrequency—without extinguishing the plasma. Two exemplary approachesinclude: (1) processing noise generated by the primary operatingfrequency of a generator in order to effectively perform a low-powersampling sweep of an interested frequency range; or (2) generating a lowpower signal in addition to the primary power signal, where the lowpower signal is used to scout for the global optimum.

In both cases, the low power nature of the noise or the scouting signalenables exploration of a frequency range while the primary power signalof the generator remains at a frequency (e.g., at a local optimum of themeasure of performance) where sufficient power can be delivered to theplasma load to sustain the plasma. For instance, the primary powersignal can remain at or near a local optimum while the scouting signalor noise (both will be hereafter referred to as a “secondary powersignal”) finds the global optimum thereby continuing to allowsubstantial power to reach the plasma load while the scouting occurs.

In the case where the secondary power signal is noise, the noise caneither be inherent noise generated as a result of the primary powersignal, or the noise can be added to the primary power signal. The noisecan occur at a plurality of secondary frequencies sometimes limited to abandwidth governed by a filter applied to the primary power signal.Where the secondary power signal is a low-level signal, such a signalcan be orders of magnitude lower than an amplitude of the primary powersignal (e.g., −3 dB, −5 dB, −10 dB, −20 dB, −50 dB, −100 dB). Thelow-level signal can be sinusoidal or any other type of periodic signaland can be generated at RF or other frequencies. Signals that start at afinite time and eventually become sinusoidal or periodic are consideredto be sinusoidal or periodic, respectively. The low-level signal can beswept across a fixed range of secondary frequencies. Alternatively, thelow-level signal can ‘hop’ between secondary frequencies according to atuning algorithm that searches for a global optimum.

A global optimum may be found by comparing the optimality of differentfrequencies and choosing the most optimal frequency. For example, if themeasure of optimality is the smallest load reflection coefficientmagnitude, then the estimated load reflection coefficient magnitude atthe different frequencies scouted by secondary power signal source arecompared and the frequency at which the load reflection coefficient isthe smallest is chosen as the global optimum frequency. The measuringand comparing to find the optimum can occur sequentially or, e.g., inthe case where noise is used as the secondary power signal, theoptimality of different frequencies can be computed simultaneously andthe most optimal frequency chosen after the computation at the differentfrequencies.

Once the global optimum has been found, the primary power signal can beshifted to a frequency of the global optimum. Such shifting can involvea sudden switch from one frequency to another or can involve a power tothe secondary power signal being ramped up while power to the primarypower signal is ramped down such that the secondary power signal becomesthe primary power signal.

Once the primary power signal is operating at a frequency of the globaloptimum, further fine tuning can occur. For instance, the secondarypower signal can again go out in search of the global optimum, eitherbecause the global optimum at the power level of the primary powersignal is different than a global optimum for the lower power of thesecondary power signal, or because the global optimum varies and haschanged since the first iteration of tuning occurred.

FIG. 1 illustrates a power generation system configured for automatedfrequency tuning of power delivered to a plasma load. The powergeneration system 100 is configured to provide radio frequency (RF)power to the plasma 106 or plasma load via RF impedance matchingcircuits which can be an optional filter 122 internal to the powersource 110 and/or a matching network 104 external to the power source110. Filtering and impedance matching are frequently done by the samephysical network. Hence a filter such as optional filter 122 can performthe function of both filtering and impedance matching.

The power generation system 100 can include a power source 110 thatconverts external power 140 to RF power and the power source 110 may bea 13.56 MHz generator, but this is certainly not required. Otherfrequencies and other power sources 100 are contemplated. The powergeneration system 100 is configured to provide RF power (e.g., an RFvoltage) at a sufficient level to ignite and sustain a plasma 106 thatis contained in the plasma chamber 108. The plasma 106 is generally usedto process a work piece or substrate (not shown) but is well known tothose skilled in the art.

The power source 110 can apply a primary power signal primarily at aprimary frequency to an output. The output can be configured forcoupling to an optional matching network 104 and to a plasma chamber108. In particular, the primary power signal can be delivered to aplasma 106 or to a load of the plasma 106 (also known as the plasmaload). The connection(s) 130 from the power source 110 to the optionalmatching network 104 are frequently coaxial cables, although other cabletypes and connection types are also possible. The connections(s) 131from the matching network 104 to the plasma chamber 108 are frequentlymade via custom coaxial connectors, although other cable types andconnection types are also possible. In some applications there is nomatching network 104 and the power source 110 is connected directly tothe plasma chamber 108. In this case RF impedance matching is doneinternal to the power source 110 with the optional filter 122. In someapplications other optional RF or DC generators 150 can be connected tothe plasma chamber 108 via the optional matching network 104. In someapplications other optional RF or DC generators 151 can connect to theplasma chamber 108 via other means, e.g., other optional matchingnetworks 105. The connection of other generators to the plasma loadeither via the matching network(s) 104 or through other means (e.g.connected to a different electrode to deliver power to the same plasma)generally makes the frequency tuning problem more complicated. In thefollowing descriptions the possibility of other optional generator(s)150 and 151 and other means of connecting to the plasma (e.g. matchingnetwork(s) 105) are not excluded, but for simplicity will not beillustrated or discussed further.

The sensor 112 can monitor a characteristic indicative ofgenerator-delivered power or delivered power capability, such asreflected power, delivered power or impedance mismatch, to name justthree non-limiting examples. Further non-limiting examples of acharacteristic indicative of delivered power or delivered powercapability include power delivered to the matching network 104, thepower reflected from the matching network 104, the power delivered tothe plasma chamber 108, the load impedance seen by the power generationsystem 100, and a characteristic of the plasma chamber 108 such asplasma density. The sensor 112 can also monitor a characteristicindicative of stability of the plasma system such as fluctuations inload impedance. The sensor 112 can also monitor a characteristicindicative of the nonlinear nature of the plasma load such as thegeneration of mixing and intermodulation products.

The use of a secondary signal source to implement frequency tuning ofthe generator has the additional benefit that measurements of the plasmaproperties can be made from the generator. The optional matchingnetwork(s) 104 typically act as band pass filters. This property of thematching network(s) 104 makes it difficult to make reliable measurementsof the plasma at the harmonics of the generator output frequencyalthough such information could be useful. However, the modulation ofthe plasma impedance can be characterized by observing the mixing andintermodulation products that are generated by the secondary signalsource. For example, if the primary signal source is at 13.56 MHz andthe secondary signal source is at 13.57 MHz, one expects a mixingproduct at 13.55 MHz and intermodulation products at 13.56 plusmultiples of 10 kHz, e.g. at 13.53, 13.54, 13.58, etc. Measuring theamplitude and phase relationship of the mixing and intermodulationproducts and deducing e.g. the amount of amplitude and phase modulationpresent can provide information about the plasma properties. Theprocessing of the information can be done in a number of ways, fromsimply analyzing the time series of measurements from the sensor andperforming higher order statistics on the time series to using dedicatedreceivers tuned to the mixing and intermodulation product frequencies toextract the amplitude and phase relationships to using any number ofmathematical transformations including but not limited to the discreteFourier transform. Monitoring the mixing and intermodulation productsand detecting changes in the characteristics of the plasma indicated bye.g. the amount of phase modulation to name but one property can beuseful in e.g. end-point detection in e.g. etch operations in themanufacture of semiconductors.

The sensor 112 can be a directional coupler, current-voltage sensor orother multi-port network and can monitor current and voltage orcombinations of voltage and current (e.g. incident and reflectedsignals) between the power source 110 and matching network 104 orbetween the matching network 104 and the plasma chamber 108. In anothernon-limiting example, the sensor 112 can be an optical detector directedinto the plasma chamber 108 to optically measure a density of the plasma106. These examples in no way describe the scope or limits of the sensor112 or the positions where the sensor 112 can be arranged, but insteaddemonstrate that the sensor 112 can take a variety of forms and can becoupled to the system in a variety of ways (see FIGS. 2-7 for variousnon-limiting examples). In addition, the sensor 112 may be a sensor orsensors that already reside in the optional matching network(s) 104 orplasma chamber 108.

Signals from the sensor 112 or sensors already residing in the matchingnetwork(s) 104 and plasma chamber 108 can be provided to the one or morecircuits 114 that are also in communication with, and control, the powersource 110. The one or more circuit(s) 114 can use the information fromthe sensor 112 and/or sensors already residing in the matchingnetwork(s) 104 and plasma chamber 108 to tune the primary and/orsecondary frequencies that the power source 110 operates at to optimizedelivered power to the plasma 106 or to optimize another measure ofoptimality such as plasma stability.

In some cases, such tuning results in operation at a local optimum(e.g., a local minimum of reflected power or a local maximum ofdelivered power, to name just two examples), so some tuning algorithmsare able to further adjust the primary frequency in order to seek outthe global optimum (e.g., via a series of fast frequency ‘hops’).However, such searching can take the power through regions of thefrequency spectrum that are poorly impedance matched (e.g., around f_(a)in FIG. 8), and thus can cause delivered power to drop significantly,and in some cases can cause the plasma 106 to be extinguished (e.g., atf_(a) in FIG. 8).

To avoid this, such searching for the global optimum can be performed byone or more secondary signals, thus enabling the high powered primarypower signal to remain at a frequency (e.g., at a local optimum) wheresufficient power can be delivered to the plasma 106 while the search forthe global optimum proceeds. FIGS. 11-13 show plots of the monitoredcharacteristic as a function of frequency and how a secondary powersignal having substantially lower amplitude than a primary power signalcan be used to search out the global optimum. These plots will bediscussed in depth later once related systems and apparatuses have beendescribed.

FIG. 1 illustrates a power generation system for automated frequencytuning of power delivered to a plasma load. A power source 110 canprovide a primary power signal to a plasma load of a plasma 106 in aplasma processing chamber 108 where the impedance seen by the powersource 110 is impedance matched by a matching network 104 arrangedbetween the power source 110 and the plasma chamber 108 and by frequencytuning of the power source 110. The power source 110 can be frequencytuned in order to find optimum frequencies, typically where deliveredpower is optimized, but other measures of optimality may be used. Suchtuning can sometimes result in the primary power signal from the powersource 110 being tuned to a local optimum rather than a global optimum.In such cases, one or more secondary signals can be generated by thepower source 110 and processed to identify a global optimum withouthaving to use the primary power signal to scout out the global optimum.

In other cases, a secondary power source can provide the secondary powersignal (for example, see FIGS. 4 and 6). The one or more secondary powersignals can be provided at an amplitude or power level below that of theprimary power signal (or substantially below the primary power signal, afraction of the primary power signal, or at such a substantially lowerpower level as to have a negligible effect on the plasma 106 as comparedto the primary power signal). The one or more secondary power signalscan include a plurality of secondary frequencies all generated at thesame time (e.g., FIGS. 11-13). In an alternative, the one or moresecondary power signals can be tuned to two or more differentfrequencies at different times (e.g., as depicted in FIGS. 11-13).

The one or more secondary power signals can be used to sample powerdelivery at frequencies other than that of the primary power signalwithout applying so much power at these secondary frequencies as toinfluence the plasma. In other words, the primary power signal canremain at a frequency where the plasma can be sustained (e.g. at or neara local optimum) while the one or more secondary power signals are usedto search for the global optimum.

In particular, the sensor 112, or two or more sensors, and/or sensorsalready present in other components of the power generation system 100can monitor a measure of performance at the frequency of the primarypower signal as well as at the secondary frequencies. The one or moresensors (e.g., sensor 112) can also measure at the frequencies ofexpected mixing and intermodulation products to extract informationabout the nonlinear characteristics of the plasma 108. For instance,changes in the mixing and intermodulation products can be used to senseplasma ignition or end-point detection for plasma processes. Theinjection of a secondary frequency component or components andmeasurement of the properties of the mixing and intermodulation productscan sense nonlinear characteristics of the plasma 108 at harmonics ofthe primary power signal even though the match network(s) 104 and thefilter 122 may not allow direct measurement of the harmonics.

For instance, the sensor 112 can be a reflected power sensor or adelivered power sensor, and the characteristic can be reflected power ordelivered power, respectively. Other characteristics can also bemonitored and used to identify local and global optimums (e.g., loadimpedance seen by the power source 110, voltage and current of power ona supply cable 130 to the matching network(s) 104, and plasma 106density, to name a few non-limiting examples). The sensor 112, and/orother sensors can provide information describing the characteristic(s)to one or more circuits 114 (e.g., logic circuits, digital circuits,analog circuits, non-transitory computer readable media, andcombinations of the above). The one or more circuits 114 can be incommunication (e.g., electrical communication) with the sensor 112 andthe power source 110. The one or more circuits 114 can adjust theprimary frequency of the power source 110 in order to tune the powersource 110 to optimize delivered power to the plasma load.

In some embodiments, optimizing a measure of performance includescontrolling a feedback loop that uses a secondary power signal in orderto scout out or search for a global optimum. In such a case, the one ormore circuits 114 can control the secondary power signal and its one ormore secondary frequencies, based on feedback from the sensor 112 (ortwo or more sensors, and/or sensors already present in other componentsof the power generation system 100) regarding a measure of performance.For instance, a frequency of the secondary power signal can be sweptacross a fixed range of frequencies encompassing the primary frequencyof the primary power signal, and the one or more circuits 114 canmonitor a measure of performance as a function of frequencies of thesecondary power signal. Based on this sweep, the one or more circuits114 can identify a global optimum and then instruct the power source 110to adjust its primary frequency so as to move the primary power signalto the identified global optimum. Frequency hops or other tuning schemescan be used to find the global optimum via the one or more secondarypower signals.

The secondary power signal can take a number of different forms. In onecase, the one or more circuits 114 can instruct the power source 110 toapply a secondary power signal in the form of a low level signal at theone (e.g., as depicted in FIG. 11) or more (e.g., as shown in FIG. 12)secondary frequencies, either applying a low level signal at thosesecondary frequencies in a particular order (e.g., FIG. 11), oraccording to an algorithm to optimize the measure of performance (e.g.,FIG. 12). In another case, the one or more circuits 114 can instruct thepower source 110 to apply a secondary power signal in the form of noise.This noise can be inherent to the primary power signal, in which case,the one or more circuits 114 do not necessarily have to supply aninstruction to the power source 110, or can be non-inherent noise thatis added to an output of the power source 110 (e.g., as shown in FIGS. 6and 7).

Whatever form the secondary power signal appears in, in manyembodiments, its amplitude is one or more orders of magnitude lower thanthat of the primary power signal. For instance, the secondary powersignal can be between 1 and 100 dB lower than the primary power signal.In other embodiments, the secondary power signal can be 1 dB, 5 dB, 10dB, 20 dB, 50 dB, or 100 dB lower than the primary power signal.

As shown the one or more circuits 114 may include a global optimumidentification module 116 and a frequency control module 118. The globaloptimum identification module 116 can analyze the information from thesensor 112 at each of the one or more secondary frequencies and identifya frequency corresponding to a global optimum. This frequency can bereferred to as an identified-global-optimum frequency and it correspondsto a global optimum of the characteristic of the generator-deliveredpower. The frequency control module 118 can adjust the primary frequencyof the primary power signal both during initial tuning of the primarypower signal, which may result in identification of a local optimum, aswell as adjustment of the primary frequency towards an identified globaloptimum frequency once a global optimum is identified by the globaloptimum identification module 116.

In particular, once an identified-global-optimum frequency isidentified, the frequency control module 118 can instruct the powersource 110 to adjust the primary frequency to jump to theidentified-global-optimum frequency, or to lower the amplitude of theprimary frequency while increasing the amplitude of the secondaryfrequency at the identified-global-optimum frequency, so that theprimary and secondary frequencies reverse roles. In this way, theprimary frequency can be transitioned to a frequency corresponding to aglobal optimum of the power characteristic (e.g., low reflected power orlow level of oscillations) without applying power in a region of thefrequency spectrum that could inhibit or extinguish the plasma (e.g.,around f_(a) in FIGS. 8-13).

The operation of the global optimum identification module 116 and thefrequency control module 118 can be cyclical to repeatedly improve anaccuracy of adjusting the primary frequency toward a global optimum. Forinstance, where the characteristic (e.g., plasma impedance) beingmonitored is nonlinear, a global minimum for the characteristic may befound when the low level secondary power signal is applied, but when themuch larger primary power signal is applied at the same frequency, adifferent global optimum frequency may exist for the higher poweredsignal. So, the secondary power signal can again be used to further honein on a global optimum for the primary power signal and this cancontinue in a looping fashion for multiple iterations. Adjusting afrequency toward a global optimum can include changing the frequency toa frequency associated with the global optimum or merely changing thefrequency to a frequency closer to the global optimum than to anoriginal frequency.

In some embodiments, the primary frequency can be switched to one of theone or more secondary frequencies as soon as the one or more secondaryfrequencies begin to descend/ascend a steep enough portion of thefrequency curves (e.g., between f_(a) and f₀ in FIGS. 8-14). When such asteep portion of the curve is identified, the global optimumidentification module 116 may determine that it is approaching a globaloptimum and thereby instruct the power source 110 to switch the primaryfrequency to a frequency near that of the secondary power signal,thereby enabling the primary power signal to jump over and avoid regionsof the frequency curve that could inhibit the plasma (e.g., aroundf_(a)). Once the primary power signal switches frequency, the one ormore secondary power signals can continue to hone in on the globaloptimum, or the primary power signal can be used to further hone in onthe global optimum.

In many embodiments supply connection(s) 130 can be realized by a pairof conductors, or a collection of two-conductor coaxial cables thatconnect the power source 110 with the matching network 104. In otherembodiments, the cable 130 is implemented with one or more twisted-paircables. In yet other embodiments, the cable 130 may be realized by anynetwork of cable, including, but not limited to, a simple conductorhookup and quadrapole connections. The connection(s) 131 is frequentlyimplemented with a connector, but can also take a variety of formsincluding simple conductor hookup.

The matching network 104 may be realized by a variety of match networkarchitectures. As one of ordinary skill in the art will appreciate, thematching network 104 can be used to match the load of the plasma 106 tothe power source 110. By correct design of the matching network(s) 104or 105, it is possible to transform the impedance of the load of theplasma 106 to a value close to the desired load impedance of the powersource 110. Correct design of the matching network(s) 104 or 105 caninclude a matching network internal to the power source 110 (e.g., viafilter 122) or a matching network external to the power source 110 asseen in FIGS. 1-7.

The one or more circuits 114 can be original equipment of the powergeneration system 100, while in other embodiments, the one or morecircuits 114 can be retrofit components that can be added to a powergeneration system that was not originally capable of the hereindescribed frequency tuning.

In an embodiment, the power generation system 100 can include anoptional filter 122. The filter 122 can be configured to attenuateportions of the primary power signal outside of a selected bandwidth anddo additional impedance matching. For example, because 50 ohm is thedominant impedance for cables and connectors 130, the desired impedanceseen at the output of the power source 110 is typically 50 ohm or someother convenient impedance. The impedance at the input (at the oppositeside from the output of the power source 110) of the filter 122 providesthe impedance desired by the active elements of the power source (e.g.MOSFETs) and is typically very different from 50 ohm, e.g. 5+j6 ohm istypical for a single MOSFET amplifier. For such a system the filter 122will then be designed to match 50 ohm at the output to 5+j6 ohm at theinput. In addition to impedance matching the filter is also typicallydesigned to limit harmonics generated by the active elements. E.g. thefilter can be designed to match 50 ohm at the output to a value close to5+j6 over the range of frequencies over which the generator is expectedto operate, e.g. from 12.882 to 14.238 MHz and suppress signals atfrequencies higher than 25 MHz by a certain amount, typically at least20 dB at the second or third harmonic of the output.

The sensor 112 can be arranged in a variety of locations, includingthose that are part of the power generation system 100, and those thatare external thereto. Where the sensor 112 monitors a characteristic canalso vary from embodiment to embodiment, as will be seen in FIGS. 2-7.

FIG. 2 illustrates one embodiment of a power generation system 200 wherethe sensor 212 resides within a power generation system 200 along with apower source 210 and one or more circuits 214. The power generationsystem 200 includes an output 220 configured for coupling to theoptional matching network(s) 204 or directly to the plasma chamber 208if the matching network(s) 204 is not present. Thus, the primary powersignal and the one or more secondary power signals can be provided tothe output 220 and hence configured for delivery to the matchingnetwork(s) 204.

FIG. 3 illustrates one embodiment of a power generation system 300 wherea sensor 312 resides outside the power generation system 300. Here thepower generation system 300 includes the power source 310, one or morecircuits 314, an optional filter 322, and an output 320 to the powergeneration system 300. The sensor 312 is coupled to the one or morecircuits 314 and provides information describing a measure ofperformance (e.g. load reflection coefficient magnitude or plasmadensity). The sensor 312 monitors the characteristic either between thepower generation system 300 and an optional matching network(s) 304,between the matching network(s) 304 and the plasma chamber 308, or atthe plasma chamber 308, or between the power generation system 300 andplasma chamber 308 if the match network(s) 304 is not present. Thesensor 312 could also perform monitoring at or within the matchingnetwork(s) 304.

While FIGS. 1-3 illustrate a single power source 110, 210, 310, one ofskill in the art will recognize that this power source 110, 210, 310 iscapable of generating both the primary and secondary power signalsconcurrently. For instance, the power source 110, 210, 310 can sourceboth a high power primary power signal and a low level secondary powersignal, or the power source 110, 210, 310 can source a high powerprimary power signal and use the noise inherent to that primary powersignal as the secondary power signal, to name two non-limiting examples.Alternatively, the power source 110, 210, 310 can generate a primarypower signal and combine this with generated or amplified noise. Whileeach of these examples demonstrate how a single power source 110, 210,310 can produce both the primary power signal and the secondary powersignal, FIGS. 4-7 will illustrate embodiments where a power sourcegenerates the primary power signal and a low level signal sourcegenerates the secondary power signal.

FIG. 4 illustrates an embodiment of a power generation system 400 havinga power source 410, a low level signal source 411, one or more circuits414, an optional sensor 412 that can be arranged within the powergeneration system 400 or an optional sensor 413 that can be arrangedoutside the power generation system 400, and a combiner 424 thatcombines the outputs from the power source 410 and low level signalsource 411. As one of ordinary skill in the art will appreciate, thecombiner may be realized by a coupler known in the art.

FIG. 5 illustrates an embodiment of a power generation system 500 wherethe primary and secondary signals are combined before being amplified bya power amplifier 550.

FIG. 6 illustrates an embodiment of a power generation system 600 wherethe power source 610 generates the primary power signal and a noisesource 613 generates the secondary power signal in the form of noise.The primary power signal and the secondary power signal, or noise, canbe combined in the power generation system 600 and the combined signalcan be provided to an output 620 of the power generation system 600. Asone of ordinary skill in the art will appreciate the noise source 613may be realized by a variety of different types of devices include anoise diode. Beneficially, the noise source 613 may generate a continuumof secondary frequencies, and the response of the secondary frequenciesmay be processed in parallel at a plurality of different frequencies(e.g., by a plurality of demodulating channels or fast Fourier transformmodule(s)). For example, a reflection coefficient at the plurality offrequencies may be arrived at in parallel to identify a frequency thatprovides a low reflection coefficient, a stable frequency, or a balancebetween stability and a low reflection coefficient.

FIG. 7 illustrates an embodiment of a power generation system 700 wherethe primary and secondary signals are combined before being amplified bya power amplifier 750. In this embodiment, the secondary signal isgenerated by a noise source 713.

The systems illustrated in FIGS. 1-7 can be more easily understood withreference to the plots seen in FIGS. 8-15.

FIG. 8 shows a plot of a measure of performance as a function of thefrequency. The solid line 801 shows the actual measure of performance(e.g., load reflection coefficient magnitude) as a function of frequencythat would result if the primary power signal were adjusted to eachfrequency and the measurement made. The dotted line, 802, shows theestimated measure of performance obtained using a secondary power signalor signals while the primary power signal remains at a fixed frequency(e.g., f₁).

As discussed, the power level of the primary frequency affects themeasure of performance (e.g., load reflection coefficient); thus themeasure of performance that is estimated using low-level power signalswill differ from the measure of performance at the higher power of theprimary signal. But as discussed further herein, the low level signalsenable the desired primary frequency (e.g., that produces a lowreflection coefficient and/or low instabilities) to be closelyestimated. The frequency of the primary signal may then be fine-tuned atthe higher power level without testing frequencies that may result inthe plasma being extinguished.

FIG. 9 depicts an aspect where an initial primary frequency may beapplied between f₁ and f_(a), and how a frequency tuning algorithm (thatrelies on sweeping and testing the frequency of the primary power) canbecome trapped in a local optimum of a measure of performance withoutthe information provided by low power secondary signals. Morespecifically, a tuning algorithm can tune the primary frequency towardwhat is believed to be an optimum frequency at f₁. In particular, FIG.9A shows a measure of performance (e.g., reflection coefficient) as afunction of frequency; the solid line of FIG. 9B shows how an algorithmusing only the primary power could adjust the primary power signalfrequency to minimize the measure of performance; and FIG. 9C shows thespectrum (power per bandwidth, e.g., Watt per 3 kHz bandwidth) of thepower generation system output 220, 320, 420, 520, 620 or 720 at time t2in FIG. 9B. As shown by the dotted line in FIG. 9B, a global optimumfrequency could be identified using low level secondary signals.

But as shown by the solid line, upon reaching that local optimum at f₁,if the primary frequency is used to search out the global optimum, suchattempts might lead to application of power around the frequency f_(a),which may result in extinguishing the plasma as seen in FIGS. 10A and10B. FIG. 10A shows a measure of performance as a function of frequency.The solid line in FIG. 10A shows the measure of performance with a litplasma, and the dotted line shows the measure of performance for anextinguished plasma. FIG. 10B shows how a global search using theprimary power signal can lead to an extinguished plasma because notenough power can be delivered around f_(a) to sustain the plasma. FIG.10C shows the spectrum of the power generation system output at time t2in FIG. 10B.

Instead, one or more secondary power signals can be used to search outthe global optimum, as shown in FIG. 11 (showing one secondary powersignal) and FIG. 12 (showing multiple secondary power signals), whilethe primary power signal remains at a fixed frequency (e.g., at or neara local optimum). In FIG. 11, shown is frequency tuning using asecondary power signal in the form of a low level signal at a singlesecondary frequency applied in a particular order. FIG. 12 showsfrequency tuning using a secondary power signal in the form of a lowlevel signal with spectral components at multiple secondary frequenciesadjusted according to an algorithm to optimize a measure of performance.

As shown, the one or more secondary power signals can be applied atpower levels far below that of the primary power signal and can beapplied at one or more secondary frequencies. The secondary frequenciescan be fixed frequencies with equal or unequal spacing, or can bevariable frequencies as shown in FIG. 12. Further, the primary andsecondary power signal(s) can be applied concurrently.

As illustrated in FIG. 11 the secondary signals can be appliedcontinuously, or as illustrated in FIG. 12, only while searching for aglobal optimum. Further, while a single characteristic is shown in theplots of FIGS. 8-13, in other embodiments, multiple characteristics,e.g., load reflection coefficient magnitude together with plasmastability measured through (e.g., fluctuations in load impedance) can besimultaneously monitored and an analysis of all the monitoredcharacteristics (or a plurality of the monitored characteristics) can beused to identify a global optimum. In this way, the global optimum isidentified without applying the full power of the primary signal aroundf_(a) or any frequencies that could extinguish the plasma.

In some modes of operation, the amplitude of the one or more secondarypower signals applied at the one or more secondary frequencies is sosmall that it can be considered negligible in comparison to the primarypower signal, and hence, does not have a significant influence on theplasma. In other applications, the amplitude of the secondary powersignal or signals may be significant compared to the primary powersignal if the goal is simply to not extinguish the plasma whilesearching for the global optimum. In such a case care must be taken notto exceed the voltage and current ratings of the plasma system becauseof high resulting amplitude at the beating frequencies.

FIG. 11 shows an embodiment where a single secondary frequency iscontinuously swept over a frequency range. The range over which thesecondary frequency(s) is (are) swept would typically be the range offrequencies over which the power generation system is expected tooperate (e.g. 12.882 to 14.238 MHz), but it does not have to be thecase. Examples in which other frequency ranges can be considered includewhen information about the plasma condition is extracted using thesecondary power signals by, for example, analyzing mixing andintermodulation products. In other cases as illustrated in FIG. 12, thesecondary frequency or frequencies can be adjusted according to analgorithm to find the optimal frequency rather than sweep in apre-determined pattern as shown in FIG. 11. Also as shown in FIG. 12,once a global optimum has been identified, the secondary power signalsmay be shut off rather than be applied continuously as shown in FIG. 11.

As illustrated in FIG. 11A and FIG. 12A, the estimate of optimumfrequency using the secondary power signal or signals may not correspondexactly to the true optimum. Typically such discrepancy would resultfrom the nonlinear nature of the plasma load. As illustrated in FIG. 11Band FIG. 12B, following a determination of the optimum frequency usingthe secondary power signals, the primary frequency may be adjusted tofurther optimize performance. FIGS. 11C and 12C depict spectralcomponents of the primary and secondary frequencies of FIGS. 11B and11C, respectively.

FIG. 13 shows the case where the secondary power signal is noise. FIG.13C shows the spectrum of the power generation system output at time t2in FIG. 13B. The noise can either be inherent to the primary powersignal or can be added to the power generation system output (e.g., seeFIGS. 6 and 7). FIG. 13B shows noise power as a function of timeassuming the case where noise is added to the power generation systemoutput.

Once a global optimum has been identified, the primary power signal canbe adjusted or switched to (or toward) the frequency corresponding tothe global optimum without the primary power signal passing throughregions of the frequency spectrum that could inhibit the plasma (e.g.,near f_(a)). For instance, in FIG. 14, the primary power signalamplitude is ramped down while an amplitude of the secondary frequencyat the global optimum is ramped up. In this way, the primary powersignal and the secondary power signal switch places. FIG. 15 showsanother variation of switching the primary frequency toward the globaloptimum, in which the frequency of the primary power signal is changedabruptly to the identified global optimum frequency.

In some embodiments, the identified global optimum frequency can beselected from one of the secondary frequencies, but this is notnecessary. For instance, the identified global optimum frequency may bebetween two of the two or more secondary frequencies. For instance,interpolation between ones of the secondary frequencies can be used toidentify the identified global optimum frequency.

FIG. 16 illustrates a method for frequency tuning a power generationsystem to hone in on a global optimum of a measure of performance usinga secondary power signal to find the global optimum. The method 1600applies a primary power signal primarily at a primary frequency to aplasma system (e.g., matching network(s) 104 connected to a plasmachamber 108) (Block 1602). Concurrently, the method 1600 applies alow-level signal to the plasma system at one or more or a continuum(e.g., as in the case of noise) of secondary frequencies (Block 1604).

The low-level signal can be periodic or the sum of periodic signals, canbe noise inherent to the primary power signal, or can be noise added tothe primary power signal. The one or more secondary frequencies can beequally spaced in frequency or can have a varying spacing. The one ormore secondary frequencies can be applied all at once or at separatetimes and can be adjusted over time. The one or more secondaryfrequencies can be swept across a fixed range of frequencies.Alternatively, the one or more secondary frequencies can be adjusted viafeedback to probe for and hone in on a global optimum. The one or moresecondary or continuum of secondary frequencies can be applied all thetime or only while needed.

The method 1600 monitors a characteristic that is a measure ofperformance (e.g., load reflection coefficient magnitude) as a functionof frequency, particularly at the one or more or continuum of secondaryfrequencies and/or at the primary frequency and/or at expected mixingand intermodulation products of the primary and secondary frequencies(Block 1606). The method 1600 then identifies an optimum frequencycorresponding to a global optimum of the characteristic (Block 1608).This can be done via minimization and maximization algorithms familiarto those of skill in the art. Finally, the method 1600 adjusts theprimary frequency of the primary power signal to the optimum frequencyidentified in the identifying operation (Block 1610). This adjustmentcan be made in a variety of ways. For instance, the adjustment may haveto avoid applying primary power only in regions where reflected powerapproaches 100% (e.g., around f_(a) in FIG. 8) for extended periods oftime since this may extinguish the plasma (unless e.g. the plasma issustained by another power source 150 or 151). So, the primary powersignal can be switched to the optimum frequency or the power levels ofthe primary and secondary power signals can be gradually reversed suchthat the power signals reverse places, to name two non-limitingexamples.

In some embodiments, the method 1600 ends when the primary power signalhas been moved to a frequency identified as the global optimum using thesecondary power signal or signals. However, in other instances, themethod 1600 can loop to further refine the optimization or to accountfor changes to the global optimum due to e.g. the nonlinear nature ofthe plasma load or parameters that may change over time (e.g., plasmachamber gas pressure).

The identifying of an optimum frequency (Block 1608) can occur in realtime as samples are obtained from the monitoring (Block 1606) or theanalysis can occur after a range of frequencies has been sampled. Themoving of the primary frequency (Block 1610) can occur only once theglobal optimum has been identified (Block 1608) or it can occur as soonas a more optimal frequency than the current primary frequency isidentified.

The method of using a secondary power signal to monitor characteristicscan also be used for the purpose of identifying plasma characteristicsor changes in plasma characteristics. Instead of identifying an optimumfrequency and adjusting the primary frequency towards the identifiedglobal optimum, the output or monitoring a characteristic (Block 1608)can be used to identify the plasma characteristics or changes in plasmacharacteristics. Monitoring mixing and intermodulation products can beused to monitor the nonlinear behavior of the plasma or simply to detectwhether or not the plasma is lit. Rather than looking at particularmixing and intermodulation produces, higher order statistics (e.g., thebispectrum) can be used to identify plasma characteristics or changes inplasma characteristics.

FIG. 17 shows three exemplary implementations of the sensor e.g. sensor112 or 412. The sensor can, e.g., be a directional coupler 1710 as shownin FIG. 17A or a voltage and current (VI) sensor as shown FIG. 17B, andeither implementation can include a filter 1730 and analog to digitalconverter 1720 as shown FIG. 17C.

FIG. 18 shows an exemplary implementation of the global optimumidentification module (e.g., 116 or 418). Part of the functionalityshown in FIG. 18 can also be part of the sensor. FIG. 18 shows animplementation using multiple demodulators 1810 allowing the processingof multiple frequency components at the same time. The signals 1820(labeled A) and 1830 (labeled B) can, for example, be forward andreflected power or voltage and current or some other measurement ofinterest. After multiplication 1850 by cosine and sine functions andfiltering 1840, complex vector representations of A and B at differentfrequencies labeled A₁, B₁ through A_(N), B_(N) are used in thecalculation of power and load reflection coefficients at multiplefrequencies. Typically one channel will be reserved for the primaryfrequency. The other channels can be set to the secondary frequency orfrequencies or to expected mixing and intermodulation products. As notedbefore this is just one implementation and many other implementationsusing, for example, e.g., the discrete Fourier transform rather thandedicated demodulation channels are possible.

The illustrated arrangements of the components shown in FIGS. 1-7 arelogical, the connections between the various components are exemplaryonly, and the depictions of these embodiments are not meant to be actualhardware diagrams; thus, the components can be combined or furtherseparated in an actual implementation, and the components can beconnected in a variety of ways without changing the basic operation ofthe systems.

Instead of a single secondary power source, as seen in FIGS. 4-7, two,three, four, or more secondary power sources could be used to generatetwo or more secondary power signals.

For the purposes of this disclosure, the secondary power signal can beperiodic, for instance, an RF signal. However, in other embodiments,non-periodic power signals can be used (e.g. noise).

While this disclosure has repeatedly shown tuning for local and globalminima, one of skill in the art will appreciate that tuning for localand global maxima is also envisioned and this disclosure can easily beapplied to monitored characteristics where the primary frequency of thedelivered power is optimized for a global maximum of a monitoredcharacteristic.

The methods described in connection with the embodiments disclosedherein may be embodied directly in hardware, in processor executableinstructions encoded in non-transitory processor readable medium, or ina combination of the two. Referring to FIG. 19 for example, shown is ablock diagram depicting physical components that may be utilized torealize the global optimum identification module 116 and the frequencycontrol module 118 according to an exemplary embodiment. As shown, inthis embodiment a display portion 1912 and nonvolatile memory 1920 arecoupled to a bus 1922 that is also coupled to random access memory(“RAM”) 1924, a processing portion (which includes N processingcomponents) 1926, a field programmable gate array (FPGA) 1927, and atransceiver component 1928 that includes N transceivers. Although thecomponents depicted in FIG. 19 represent physical components, FIG. 19 isnot intended to be a detailed hardware diagram; thus many of thecomponents depicted in FIG. 19 may be realized by common constructs ordistributed among additional physical components. Moreover, it iscontemplated that other existing and yet-to-be developed physicalcomponents and architectures may be utilized to implement the functionalcomponents described with reference to FIG. 19.

This display portion 1912 generally operates to provide a user interfacefor a user, and in several implementations, the display is realized by atouchscreen display. In general, the nonvolatile memory 1920 isnon-transitory memory that functions to store (e.g., persistently store)data and processor executable code (including executable code that isassociated with effectuating the methods described herein). In someembodiments for example, the nonvolatile memory 1920 includes bootloadercode, operating system code, file system code, and non-transitoryprocessor-executable code to facilitate the execution of a methoddescribed with reference to FIG. 16 and other methodologies describedherein.

In many implementations, the nonvolatile memory 1920 is realized byflash memory (e.g., NAND or ONENAND memory), but it is contemplated thatother memory types may be utilized as well. Although it may be possibleto execute the code from the nonvolatile memory 1920, the executablecode in the nonvolatile memory is typically loaded into RAM 1924 andexecuted by one or more of the N processing components in the processingportion 1926. The non-volatile memory 1920 or RAM 1924 may be utilizedfor storage of a frequency of the global optimum as described in FIGS.8-14.

The N processing components in connection with RAM 1924 generallyoperate to execute the instructions stored in nonvolatile memory 1920 toenable the source impedance of a generator to be modified to achieve oneor more objectives. For example, non-transitory processor-executableinstructions to effectuate the methods described with reference to FIGS.16 and 18 may be persistently stored in nonvolatile memory 1920 andexecuted by the N processing components in connection with RAM 1924. Asone of ordinarily skill in the art will appreciate, the processingportion 1926 may include a video processor, digital signal processor(DSP), graphics processing unit (GPU), and other processing components.A DSP, for example, may be utilized in connection with embodiments thatemploy a discrete Fourier transform to analyze aspects of power at thegenerator output that are indicative of the plasma load.

In addition, or in the alternative, the FPGA 1927 may be configured toeffectuate one or more aspects of the methodologies described herein(e.g., the method described with reference to FIGS. 16 and 18). Forexample, non-transitory FPGA-configuration-instructions may bepersistently stored in nonvolatile memory 1920 and accessed by the FPGA1927 (e.g., during boot up) to configure the FPGA 1927 to effectuate thefunctions of the global optimum identification module 116 and thefrequency control module 118.

The input component operates to receive signals (e.g., the output signalfrom sensor 112, 312, 412, 413) that are indicative of one or moreaspects of the output power and/or the plasma load. The signals receivedat the input component may include, for example, voltage, current,forward power, reflected power and plasma load impedance. It iscontemplated that the input component may include both digital andanalog inputs, and may include analog to digital conversion componentsto convert the analog signals to digital signals. The output componentgenerally operates to provide one or more analog or digital signals toeffectuate an operational aspect of the generator. For example, theoutput portion may provide a frequency control signal to the oscillatorsdepicted and described herein. It is also contemplated that signals thatcontrol amplitude and phase of applied power may also be output from theoutput component.

The depicted transceiver component 1928 includes N transceiver chains,which may be used for communicating with external devices via wirelessor wireline networks. Each of the N transceiver chains may represent atransceiver associated with a particular communication scheme (e.g.,WiFi, Ethernet, Profibus, etc.). The transceiver component may be used,for example, to communicate with one or more other devices that areassociated with a plasma processing tool.

Within this specification, the same reference characters are used torefer to terminals, signal lines, wires, etc. and their correspondingsignals. In this regard, the terms “signal,” “wire,” “connection,”“terminal,” and “pin” may be used interchangeably, from time-to-time,within the this specification. It also should be appreciated that theterms “signal,” “wire,” or the like can represent one or more signals,e.g., the conveyance of a single bit through a single wire or theconveyance of multiple parallel bits through multiple parallel wires.Further, each wire or signal may represent bi-directional communicationbetween two, or more, components connected by a signal or wire as thecase may be.

The previous description of the disclosed embodiments is provided toenable any person skilled in the art to make or use the presentinvention. Various modifications to these embodiments will be readilyapparent to those skilled in the art, and the generic principles definedherein may be applied to other embodiments without departing from thespirit or scope of the invention. Thus, the present invention is notintended to be limited to the embodiments shown herein but is to beaccorded the widest scope consistent with the principles and novelfeatures disclosed herein.

What is claimed is:
 1. A power generation system configured foridentifying characteristics of a plasma load, the power generationsystem comprising: a power source configured to apply a primary powersignal at a primary frequency to an output, the output configured forcoupling to a plasma load, either directly or through a matchingnetwork, the power source concurrently applying one or more secondarypower signals at one or more secondary frequencies to the output whereinpower produced at the secondary frequencies is lower than power producedat the primary frequency; a sensor arranged to monitor a characteristicof the power delivered to the plasma load; at least one circuit incommunication with the sensor, the at least one circuit implementing; anidentification module that analyzes the monitored characteristic toextract characteristics of the plasma load.
 2. The system of claim 1,wherein power at the secondary frequencies is between 1 and 100 dB belowpower at the primary frequency.
 3. The system of claim 1, wherein thesensor is a sensor selected from the group consisting of a voltage andcurrent sensor and a directional coupler.
 4. The system of claim 1,wherein the identification module is configured to analyze any changesin intermodulation products of the primary and secondary signals.
 5. Thesystem of claim 1, wherein the one or more secondary power signals isnoise.
 6. The system of claim 5, wherein the power source includes asingle oscillator-amplifier combination to produce the primary powersignal, and the noise is inherent to the single oscillator-amplifiercombination.
 7. The system of claim 1, wherein the power source includesa primary oscillator to generate the primary power signal and thesecondary oscillator to generate the secondary power signals.
 8. Thesystem of claim 7, wherein the secondary oscillator is configured toinject a signal at a sideband frequency of the primary frequency, andwherein the identification module is configured to analyze an oppositesideband of the injected frequency.
 9. The system of claim 8, whereinthe secondary oscillator is configured to inject the sideband frequencyat a frequency between 100 Hz and 100 kHz.
 10. The system of claim 1,including at least one demodulation channel coupled to the sensor toobtain power information for at least one particular frequency.
 11. Apower generation system configured for identifying characteristics of aplasma load, the power generation system comprising: a power source toapply a primary power signal to an output, the output configured forcoupling to a plasma load, either directly or through a matchingnetwork, the power source is configured to apply one or more secondarypower signals at one or more secondary frequencies to the plasma load,wherein power produced at the secondary frequencies is lower than powerproduced at the primary frequency; a sensor arranged to sense powerdelivered to the plasma load; and identification module to provideinformation about the plasma load, the identification module including:a non-transitory, tangible machine readable storage medium, encoded withinstructions to perform a method for providing the information about theplasma load, the method comprising: applying the primary power signal ata primary frequency to the plasma load; concurrently applying the one ormore secondary power signals at the one or secondary frequencies to theplasma load; and analyzing the monitored characteristic to extractcharacteristics of the plasma load.
 12. The power generation system ofclaim 11, wherein the machine readable storage medium storage mediumincludes instructions for sweeping the secondary frequencies across afixed frequency range.
 13. The power generation system of claim 11,wherein a spectrum of the secondary power signal includes a plurality ofsecondary frequencies at the same time.
 14. The power generation systemof claim 11, wherein the secondary power signal is tuned to differentones of a plurality of secondary frequencies at different times.
 15. Thepower generation system of claim 11, wherein mixing and intermodulationproducts of the primary and secondary signals are analyzed to extractcharacteristics of the plasma load.
 16. The power generation system ofclaim 11, wherein higher order statistics is used in analyzing thesensed power to extract characteristics of the plasma load.
 17. Thepower generation system of claim 11, wherein higher order spectra isused in analyzing the characteristic to extract characteristics of theplasma load.
 18. A power generation system configured for identifyingcharacteristics of a plasma load, the power generation systemcomprising: means for applying a primary power signal primarily at aprimary frequency to a plasma load, either directly or through amatching network; means for concurrently applying one or more secondarypower signals at one or more or a continuum of secondary frequencies tothe plasma load; means for monitoring a characteristic of the powerdelivered to the plasma load; and means for analyzing the monitoredcharacteristic to extract characteristics of the plasma load.
 19. Thepower generation system of claim 18, wherein power produced at thesecondary frequencies is lower than power produced at the primaryfrequency.
 20. The power generation system of claim 18, wherein powerproduced at the secondary frequencies is between 20 and 30 dB belowpower at the primary frequency.
 21. The power generation system of claim18, including means for sweeping the one or more secondary frequenciesacross a fixed frequency range.
 22. The power generation system of claim18, wherein a spectrum of the secondary power signal includes aplurality of secondary frequencies at a same time.
 23. The powergeneration system of claim 18, wherein the secondary power signal istuned to different ones of a plurality of secondary frequencies atdifferent times.
 24. The power generation system of claim 18, includingmeans for wherein mixing and intermodulation products of the primary andsecondary signals are analyzed to extract characteristics of the plasmaload.